Planning semiconductor substrate upgrades, business meeting and researchers in smart factory. Evaluating advanced microchips prototype, silicon wafer close up and professionals
RFID:Image ID:3EGPAK3
Image details
Contributor:
Dragos CondreaImage ID:
3EGPAK3File size:
42.1 MB (671 KB Compressed download)Releases:
Model - no | Property - noDo I need a release?Dimensions:
4696 x 3131 px | 39.8 x 26.5 cm | 15.7 x 10.4 inches | 300dpiDate taken:
28 February 2026Location:
RomaniaMore information:
Planning semiconductor substrate upgrades, business meeting and researchers in smart factory. Evaluating advanced microchips prototype, silicon wafer close up and professionals
