Housing with integrated circuit, light micrograph
RMID:Image ID:2J9TJP2
Image details
Contributor:
Science Photo LibraryImage ID:
2J9TJP2File size:
60.1 MB (3.1 MB Compressed download)Releases:
Model - no | Property - noDo I need a release?Dimensions:
5616 x 3742 px | 47.5 x 31.7 cm | 18.7 x 12.5 inches | 300dpiDate taken:
19 May 2022Photographer:
GERD GUENTHER/SCIENCE PHOTO LIBRARYMore information:
Housing with integrated circuit, light micrograph. The image shows an opened transistor outline (TO) metal housing with the mounted semiconductor chip. TO packages consist of a TO base and a TO cap. The TO socket forms the base for mounting the encapsulated semiconductor component and supplies it with power. The semiconductor in this image is a CA 1458 dual operational amplifier, manufactured in 1978. Golden bond wires connect the pins of the TO base with the semiconductor chip. Microscopic contrast method: incident darkfield. Magnification: x80 when printed at 10 centimetres wide.
